MicroStrain MicroStrain Microminiature Sensors








EmbedSense™ Wireless Sensor




Wireless sensor and data acquisition system.







EmbedSense
Description

MicroStrain, Inc. announces the availability of the miniature EmbedSense™ wireless sensor. EmbedSense™ is a tiny wireless sensor and data acquisition system that is small enough to be embedded in a product, enabling the creation of smart structures, smart materials and smart machines.

EmbedSense™ nodes can be placed within implants, on spinning machinery and within composite materials. Because they can tolerate extreme G levels and high temperatures, sensor measurements can be made in applications where previously no data could be obtained.

Batteries are completely eliminated which means that the embedded sensors and EmbedSense™ node can be queried for the life of the structure. EmbedSense™ uses an inductive link to receive power from an external coil and to return digital strain, temperature and unique ID information.

Applications range from monitoring the healing of the spine, to testing strains and temperatures on jet turbine engines.

EmbedSense™ tags can read data from multiple types of sensors, including semiconductor temperature sensors, thermocouples, strain gauges, pressure sensors, and load cells.


EmbedSense

EmbedSense diagram

Number input channels 2 Channels. 1 differential input and 1 internal temperature sensor
(Other configurations available as custom options)
Input amplifier Instrumentation amp, 110 dB CMRR, hardware programmable gain from 1 to 1000
Bridge excitation 3 VDC, regulated to 0.1%, up to 3 milliamps at 3 VDC pulsed bridge excitation
Sensor types Piezoresistive bonded foil & semiconductor strain gauges, pressure/load/torque transducers, thermocouples
A/D converter 16 bit resolution successive approx. type (standard)
(Other configurations available as custom options)
Identification (ID) Factory programmable, 16 bits
Update rates 50 Hz/channel w/ 125 kHz operating freq., 16 bit A/D
(Other configurations available as custom options)
Communication method Switched reactance, pulse code modulated serial (RS-232), clocked synchronous
Coil-to-coil separation Coil geometry dependent, 37mm min. 50mm typical
EmbedSense power 200 microamperes at 3 VDC, not including bridge excitation, obtained by rectification of external AC magnetic field
Operating temperatures -40 to +125˚C
Operating G levels Independently tested to 50,000 G's

Patents Pending

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How To Order

For individual components, additional system configurations, or quantity discounts, please contact sales@microstrain.com or call 802-862-6629.

Lead Time

Standard Lead Time for shipping is one week. In the event that longer lead times are anticipated, MicroStrain® will contact the buyer. Credit cards are billed on the date the order is shipped.